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35 lines
1.0 KiB
Plaintext
35 lines
1.0 KiB
Plaintext
Drill report for many485.kicad_pcb
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Created on 2025-03-21T17:04:16+0300
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Copper Layer Stackup:
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=============================================================
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L1 : F.Cu front
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L2 : B.Cu back
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Drill file 'many485.drl' contains
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plated through holes:
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=============================================================
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T1 0.400mm 0.0157" (58 holes)
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T2 0.600mm 0.0236" (10 holes)
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T3 0.600mm 0.0236" (4 holes)
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T4 0.700mm 0.0276" (6 holes)
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T5 0.800mm 0.0315" (9 holes)
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T6 0.800mm 0.0315" (48 holes)
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T7 0.920mm 0.0362" (4 holes)
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T8 1.000mm 0.0394" (26 holes)
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T9 1.300mm 0.0512" (20 holes)
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T10 1.500mm 0.0591" (3 holes)
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T11 2.330mm 0.0917" (2 holes)
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T12 3.200mm 0.1260" (2 holes)
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Total plated holes count 192
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Not plated through holes are merged with plated holes
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unplated through holes:
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=============================================================
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T13 3.200mm 0.1260" (4 holes)
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Total unplated holes count 4
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