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Drill report for many485.kicad_pcb
Created on 2025-03-21T17:04:16+0300
Copper Layer Stackup:
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L1 : F.Cu front
L2 : B.Cu back
Drill file 'many485.drl' contains
plated through holes:
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T1 0.400mm 0.0157" (58 holes)
T2 0.600mm 0.0236" (10 holes)
T3 0.600mm 0.0236" (4 holes)
T4 0.700mm 0.0276" (6 holes)
T5 0.800mm 0.0315" (9 holes)
T6 0.800mm 0.0315" (48 holes)
T7 0.920mm 0.0362" (4 holes)
T8 1.000mm 0.0394" (26 holes)
T9 1.300mm 0.0512" (20 holes)
T10 1.500mm 0.0591" (3 holes)
T11 2.330mm 0.0917" (2 holes)
T12 3.200mm 0.1260" (2 holes)
Total plated holes count 192
Not plated through holes are merged with plated holes
unplated through holes:
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T13 3.200mm 0.1260" (4 holes)
Total unplated holes count 4