Drill report for many485.kicad_pcb
Created on 2025-03-21T17:04:16+0300

Copper Layer Stackup:
    =============================================================
    L1 :  F.Cu                      front
    L2 :  B.Cu                      back


Drill file 'many485.drl' contains
    plated through holes:
    =============================================================
    T1  0.400mm  0.0157"  (58 holes)
    T2  0.600mm  0.0236"  (10 holes)
    T3  0.600mm  0.0236"  (4 holes)
    T4  0.700mm  0.0276"  (6 holes)
    T5  0.800mm  0.0315"  (9 holes)
    T6  0.800mm  0.0315"  (48 holes)
    T7  0.920mm  0.0362"  (4 holes)
    T8  1.000mm  0.0394"  (26 holes)
    T9  1.300mm  0.0512"  (20 holes)
    T10  1.500mm  0.0591"  (3 holes)
    T11  2.330mm  0.0917"  (2 holes)
    T12  3.200mm  0.1260"  (2 holes)

    Total plated holes count 192


Not plated through holes are merged with plated holes
    unplated through holes:
    =============================================================
    T13  3.200mm  0.1260"  (4 holes)

    Total unplated holes count 4