stm32samples/F3:F303/NitrogenFlooding/kicad/nitrogen/gerbers/nitrogen-job.gbrjob

{
  "Header": {
    "GenerationSoftware": {
      "Vendor": "KiCad",
      "Application": "Pcbnew",
      "Version": "6.0.10"
    },
    "CreationDate": "2023-01-12T17:29:40+03:00"
  },
  "GeneralSpecs": {
    "ProjectId": {
      "Name": "nitrogen",
      "GUID": "6e697472-6f67-4656-9e2e-6b696361645f",
      "Revision": "rev?"
    },
    "Size": {
      "X": 80.2,
      "Y": 80.2
    },
    "LayerNumber": 4,
    "BoardThickness": 1.66,
    "Finish": "None"
  },
  "DesignRules": [
    {
      "Layers": "Outer",
      "PadToPad": 0.2,
      "PadToTrack": 0.2,
      "TrackToTrack": 0.2,
      "MinLineWidth": 0.2,
      "TrackToRegion": 0.508,
      "RegionToRegion": 0.508
    },
    {
      "Layers": "Inner",
      "PadToPad": 0.0,
      "PadToTrack": 0.0,
      "TrackToTrack": 0.2,
      "MinLineWidth": 0.2,
      "TrackToRegion": 0.508,
      "RegionToRegion": 0.508
    }
  ],
  "FilesAttributes": [
    {
      "Path": "nitrogen-F_Cu.gbr",
      "FileFunction": "Copper,L1,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "nitrogen-GND_Cu.gbr",
      "FileFunction": "Copper,L2,Inr",
      "FilePolarity": "Positive"
    },
    {
      "Path": "nitrogen-Mixed_Cu.gbr",
      "FileFunction": "Copper,L3,Inr",
      "FilePolarity": "Positive"
    },
    {
      "Path": "nitrogen-B_Cu.gbr",
      "FileFunction": "Copper,L4,Bot",
      "FilePolarity": "Positive"
    },
    {
      "Path": "nitrogen-F_Paste.gbr",
      "FileFunction": "SolderPaste,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "nitrogen-B_Paste.gbr",
      "FileFunction": "SolderPaste,Bot",
      "FilePolarity": "Positive"
    },
    {
      "Path": "nitrogen-F_Silkscreen.gbr",
      "FileFunction": "Legend,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "nitrogen-B_Silkscreen.gbr",
      "FileFunction": "Legend,Bot",
      "FilePolarity": "Positive"
    },
    {
      "Path": "nitrogen-F_Mask.gbr",
      "FileFunction": "SolderMask,Top",
      "FilePolarity": "Negative"
    },
    {
      "Path": "nitrogen-B_Mask.gbr",
      "FileFunction": "SolderMask,Bot",
      "FilePolarity": "Negative"
    },
    {
      "Path": "nitrogen-Edge_Cuts.gbr",
      "FileFunction": "Profile",
      "FilePolarity": "Positive"
    }
  ],
  "MaterialStackup": [
    {
      "Type": "Legend",
      "Name": "Top Silk Screen"
    },
    {
      "Type": "SolderPaste",
      "Name": "Top Solder Paste"
    },
    {
      "Type": "SolderMask",
      "Thickness": 0.01,
      "Name": "Top Solder Mask"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "F.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.5,
      "Material": "FR4",
      "Name": "F.Cu/GND.Cu",
      "Notes": "Type: dielectric layer 1 (from F.Cu to GND.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "GND.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.5,
      "Material": "FR4",
      "Name": "GND.Cu/Mixed.Cu",
      "Notes": "Type: dielectric layer 2 (from GND.Cu to Mixed.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "Mixed.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.5,
      "Material": "FR4",
      "Name": "Mixed.Cu/B.Cu",
      "Notes": "Type: dielectric layer 3 (from Mixed.Cu to B.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "B.Cu"
    },
    {
      "Type": "SolderMask",
      "Thickness": 0.01,
      "Name": "Bottom Solder Mask"
    },
    {
      "Type": "SolderPaste",
      "Name": "Bottom Solder Paste"
    },
    {
      "Type": "Legend",
      "Name": "Bottom Silk Screen"
    }
  ]
}