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37 lines
1.1 KiB
Plaintext
37 lines
1.1 KiB
Plaintext
Drill report for multistepper.kicad_pcb
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Created on Вт 02 мая 2023 14:48:33
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Copper Layer Stackup:
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=============================================================
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L1 : F.Cu front
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L2 : Ground.Cu in1
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L3 : Power.Cu in2
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L4 : B.Cu back
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Drill file 'multistepper.drl' contains
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plated through holes:
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=============================================================
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T1 0.400mm 0.0157" (248 holes)
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T2 0.600mm 0.0236" (61 holes)
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T3 0.700mm 0.0276" (14 holes)
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T4 0.750mm 0.0295" (52 holes)
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T5 0.800mm 0.0315" (22 holes)
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T6 0.920mm 0.0362" (4 holes)
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T7 0.950mm 0.0374" (32 holes)
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T8 1.000mm 0.0394" (22 holes)
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T9 1.020mm 0.0402" (144 holes)
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T10 1.100mm 0.0433" (5 holes)
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T11 1.300mm 0.0512" (7 holes)
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T12 2.330mm 0.0917" (2 holes)
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T13 3.200mm 0.1260" (4 holes)
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Total plated holes count 617
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Not plated through holes are merged with plated holes
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unplated through holes:
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=============================================================
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Total unplated holes count 0
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