37 lines
1.1 KiB
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Drill report for multistepper.kicad_pcb
Created on Вт 02 мая 2023 14:48:33
Copper Layer Stackup:
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L1 : F.Cu front
L2 : Ground.Cu in1
L3 : Power.Cu in2
L4 : B.Cu back
Drill file 'multistepper.drl' contains
plated through holes:
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T1 0.400mm 0.0157" (248 holes)
T2 0.600mm 0.0236" (61 holes)
T3 0.700mm 0.0276" (14 holes)
T4 0.750mm 0.0295" (52 holes)
T5 0.800mm 0.0315" (22 holes)
T6 0.920mm 0.0362" (4 holes)
T7 0.950mm 0.0374" (32 holes)
T8 1.000mm 0.0394" (22 holes)
T9 1.020mm 0.0402" (144 holes)
T10 1.100mm 0.0433" (5 holes)
T11 1.300mm 0.0512" (7 holes)
T12 2.330mm 0.0917" (2 holes)
T13 3.200mm 0.1260" (4 holes)
Total plated holes count 617
Not plated through holes are merged with plated holes
unplated through holes:
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Total unplated holes count 0