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Drill report for shutter.kicad_pcb
Created on 2024-10-04T09:10:23+0300
Copper Layer Stackup:
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L1 : F.Cu front
L2 : B.Cu back
Drill file 'shutter.drl' contains
plated through holes:
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T1 0.600mm 0.0236" (23 holes)
T2 0.650mm 0.0256" (6 holes)
T3 0.750mm 0.0295" (10 holes)
T4 0.950mm 0.0374" (4 holes)
T5 1.000mm 0.0394" (6 holes)
T6 1.100mm 0.0433" (3 holes)
T7 1.300mm 0.0512" (2 holes)
T8 2.300mm 0.0906" (2 holes)
Total plated holes count 56
Not plated through holes are merged with plated holes
unplated through holes:
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T9 3.200mm 0.1260" (4 holes)
T10 3.500mm 0.1378" (1 hole)
Total unplated holes count 5