mirror of
https://github.com/eddyem/stm32samples.git
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171 lines
3.7 KiB
Plaintext
171 lines
3.7 KiB
Plaintext
{
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"Header": {
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"GenerationSoftware": {
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"Vendor": "KiCad",
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"Application": "Pcbnew",
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"Version": "6.0.5"
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},
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"CreationDate": "2022-11-27T13:32:37+03:00"
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},
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"GeneralSpecs": {
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"ProjectId": {
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"Name": "multistepper",
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"GUID": "6d756c74-6973-4746-9570-7065722e6b69",
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"Revision": "rev?"
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},
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"Size": {
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"X": 113.6,
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"Y": 105.6
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},
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"LayerNumber": 4,
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"BoardThickness": 4.69,
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"Finish": "None"
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},
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"DesignRules": [
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{
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"Layers": "Outer",
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"PadToPad": 0.1,
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"PadToTrack": 0.1,
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"TrackToTrack": 0.1,
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"MinLineWidth": 0.2,
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"TrackToRegion": 0.508,
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"RegionToRegion": 0.508
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},
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{
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"Layers": "Inner",
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"PadToPad": 0.0,
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"PadToTrack": 0.0,
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"TrackToTrack": 0.1,
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"MinLineWidth": 0.3,
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"TrackToRegion": 0.508,
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"RegionToRegion": 0.508
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}
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],
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"FilesAttributes": [
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{
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"Path": "multistepper-F_Cu.gbr",
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"FileFunction": "Copper,L1,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "multistepper-Ground_Cu.gbr",
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"FileFunction": "Copper,L2,Inr",
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"FilePolarity": "Positive"
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},
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{
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"Path": "multistepper-Power_Cu.gbr",
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"FileFunction": "Copper,L3,Inr",
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"FilePolarity": "Positive"
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},
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{
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"Path": "multistepper-B_Cu.gbr",
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"FileFunction": "Copper,L4,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "multistepper-F_Paste.gbr",
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"FileFunction": "SolderPaste,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "multistepper-B_Paste.gbr",
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"FileFunction": "SolderPaste,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "multistepper-F_Silkscreen.gbr",
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"FileFunction": "Legend,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "multistepper-B_Silkscreen.gbr",
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"FileFunction": "Legend,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "multistepper-F_Mask.gbr",
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"FileFunction": "SolderMask,Top",
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"FilePolarity": "Negative"
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},
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{
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"Path": "multistepper-B_Mask.gbr",
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"FileFunction": "SolderMask,Bot",
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"FilePolarity": "Negative"
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},
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{
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"Path": "multistepper-Edge_Cuts.gbr",
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"FileFunction": "Profile",
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"FilePolarity": "Positive"
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}
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],
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"MaterialStackup": [
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{
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"Type": "Legend",
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"Name": "Top Silk Screen"
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},
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{
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"Type": "SolderPaste",
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"Name": "Top Solder Paste"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Top Solder Mask"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "F.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 1.51,
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"Material": "FR4",
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"Name": "F.Cu/Ground.Cu",
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"Notes": "Type: dielectric layer 1 (from F.Cu to Ground.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "Ground.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 1.51,
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"Material": "FR4",
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"Name": "Ground.Cu/Power.Cu",
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"Notes": "Type: dielectric layer 2 (from Ground.Cu to Power.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "Power.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 1.51,
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"Material": "FR4",
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"Name": "Power.Cu/B.Cu",
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"Notes": "Type: dielectric layer 3 (from Power.Cu to B.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "B.Cu"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Bottom Solder Mask"
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},
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{
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"Type": "SolderPaste",
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"Name": "Bottom Solder Paste"
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},
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{
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"Type": "Legend",
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"Name": "Bottom Silk Screen"
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}
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]
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}
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