Drill report for multistepper.kicad_pcb
Created on 2024-03-12T14:31:06+0300

Copper Layer Stackup:
    =============================================================
    L1 :  F.Cu                      front
    L2 :  Ground.Cu                 in1
    L3 :  Power.Cu                  in2
    L4 :  B.Cu                      back


Drill file 'multistepper.drl' contains
    plated through holes:
    =============================================================
    T1  0.400mm  0.0157"  (248 holes)
    T2  0.600mm  0.0236"  (61 holes)
    T3  0.700mm  0.0276"  (14 holes)
    T4  0.750mm  0.0295"  (52 holes)
    T5  0.800mm  0.0315"  (22 holes)
    T6  0.920mm  0.0362"  (4 holes)
    T7  0.950mm  0.0374"  (32 holes)
    T8  1.000mm  0.0394"  (22 holes)
    T9  1.020mm  0.0402"  (144 holes)
    T10  1.100mm  0.0433"  (5 holes)
    T11  1.300mm  0.0512"  (7 holes)
    T12  2.330mm  0.0917"  (2 holes)
    T13  3.200mm  0.1260"  (4 holes)

    Total plated holes count 617


Not plated through holes are merged with plated holes
    unplated through holes:
    =============================================================

    Total unplated holes count 0