Drill report for stm32.kicad_pcb
Created on 2024-04-12T11:45:18+0300

Copper Layer Stackup:
    =============================================================
    L1 :  F.Cu                      front
    L2 :  B.Cu                      back


Drill file 'stm32.drl' contains
    plated through holes:
    =============================================================
    T1  0.400mm  0.0157"  (221 holes)
    T2  0.500mm  0.0197"  (2 holes)  (with 2 slots)
    T3  0.600mm  0.0236"  (45 holes)
    T4  0.600mm  0.0236"  (8 holes)
    T5  0.700mm  0.0276"  (6 holes)
    T6  0.800mm  0.0315"  (10 holes)
    T7  0.800mm  0.0315"  (65 holes)
    T8  0.920mm  0.0362"  (4 holes)
    T9  1.000mm  0.0394"  (29 holes)
    T10  1.200mm  0.0472"  (10 holes)
    T11  1.300mm  0.0512"  (19 holes)
    T12  2.330mm  0.0917"  (2 holes)
    T13  3.000mm  0.1181"  (6 holes)
    T14  3.200mm  0.1260"  (4 holes)

    Total plated holes count 431


Not plated through holes are merged with plated holes
    unplated through holes:
    =============================================================

    Total unplated holes count 0